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SiGe, High-Linearity, 850MHz to 1550MHz
Up/Downconversion Mixer with LO Buffer
ABSOLUTE MAXIMUM RATINGS
V CC to GND ...........................................................-0.3V to +5.5V
RF, LO to GND.........................................................-0.3V to 0.3V
IF+, IF-, LOBIAS to GND ............................-0.3V to (V CC + 0.3V)
RF, LO Input Power ........................................................+20dBm
RF, LO Current (RF and LO is DC shorted to GND
through balun).................................................................50mA
Continuous Power Dissipation (Note 1) ........................2100mW
θ JA (Notes 2, 3)..............................................................+33°C/W
θ JC (Note 3)........................................................................8°C/W
Operating Case Temperature Range
(Note 4) ...................................................T C = -40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1: Based on junction temperature T J = T C + ( θ JC x V CC x I CC ). This formula can be used when the temperature of the exposed
pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction
temperature must not exceed +150°C.
Note 2: Junction temperature T J = T A + ( θ JA x V CC x I CC ). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150°C.
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
Note 4: T C is the temperature on the exposed pad of the package. T A is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, V CC = +4.75V to +5.25V, no input AC signals. T C = -40°C to +85°C, unless otherwise noted. Typical val-
ues are at V CC = +5.0V, T C = +25°C, unless otherwise noted.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Supply Voltage
Supply Current
V CC
I CC
Total supply current
4.75
5
105
5.25
130
V
mA
RECOMMENDED AC OPERATING CONDITIONS
PARAMETER
RF Frequency
LO Frequency
SYMBOL
f RF
f LO
(Notes 5, 6)
(Note 5)
CONDITIONS
MIN
850
1200
TYP
MAX
1550
2250
UNITS
MHz
MHz
Meeting RF and LO frequency ranges; IF
IF Frequency
f IF
matching components affect the IF
50
1000
MHz
frequency range (Note 5)
LO Drive Level
P LO
-3
+9
dBm
2
_______________________________________________________________________________________
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